

Packaging and Testing of
Silicon Wafer
We offer various type of packaging and testing solutions for each type of wafers




Silicon Wafer Reclamation
We provide wafers reclamation services to minimize cost and wastage
Products and Services
Discover our extensive selection of products and services.
Die/Wire Bond Test Silicon Wafers
We provide test wafers for die and wire bonding process




Silicon Wafer Thin Film Coating
We can coat various material onto wafers to suit customers' needs
Wafer Cassette and LED (Vacuum Packaging Service)
We provide vacuum packaging for wafer cassette and LED
Customized TAIKO WAFER
We custom-made TAIKO Wafer to our customers' needs


Semiconductors, Optoelectronics and other materials
Various materials of choice




Silicon wafers, Dummy wafers, Coating wafers, Mirror wafers
Various kind of wafers
Bare, AL, Copper Oxide Wafers
Various kind of wafers






Acquisition of 12" Wafers (Thickness 720-810nm) any PN type
We acquire wafer from factory
Nitrogen Aluminium, Silicon Carbide (grinding and polishing)
Wafer grinding and polishing
Daisy Chain Wafer
Daisy chain wafer


Wafer for Laser Dicing
We provide wafer for laser dicing process


Dicing Pattern Wafer
We provide service for dicing pattern wafer
Technical Data









Contact Us
Quick Links
send us a message
Tel.: +6011-2775 4481 (James Hsiao)
+604-222 8835
Fax: +604-222 8801
Email: james@jhitech.com.my
© 2024 JHI Tech Sdn. Bhd. All Rights Reserved.
JHI TECH SDN. BHD. 202301046867 (1540781-P)
(S01) Suite 163E, Level 16, Hunza Tower Gurney Paragon, Jalan Kelawei, Georgetown, 10250 Penang, Malaysia.